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1109 In Stock
2N7002-13-F
1109 In Stock
2N7002-13-F
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Manufacturer No:
Diodes Incorporated
Manufacturer:
Diodes Incorporated
Category:
MOSFETs
Package:
SOT-23
Datasheet:
Description Differential:
Trans MOSFET N-CH 60V 0.21A 3-Pin SOT-23 T/R
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Type
DESCRIPTION
HTS
8541.21.00.95
PPAP
No
EU RoHS
Compliant
Category
Small Signal
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
3
Automotive
No
Lead Shape
Gull-wing
PCB changed
3
Part Status
Active
Channel Mode
Enhancement
Channel Type
N
Configuration
Single
Package Width
1.3
Package Height
0.98
Package Length
2.9
Supplier Package
SOT-23
Maximum IDSS (uA)
1
Standard Package Name
SOT
Typical Fall Time (ns)
5.6
Typical Rise Time (ns)
3
Number of Elements per Chip
1
Maximum Power Dissipation (mW)
540
Typical Gate Charge @ Vgs (nC)
0.223@4.5V
Maximum Gate Source Voltage (V)
±20
Typical Output Capacitance (pF)
11
Typical Turn-On Delay Time (ns)
2.8
Maximum Drain Source Voltage (V)
60
Typical Turn-Off Delay Time (ns)
7.6
Maximum Diode Forward Voltage (V)
1.5
Typical Diode Forward Voltage (V)
0.78
Typical Gate to Drain Charge (nC)
0.178
Maximum Gate Threshold Voltage (V)
2.5
Minimum Gate Threshold Voltage (V)
1
Typical Gate to Source Charge (nC)
0.082
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Maximum Continuous Drain Current (A)
0.21
Operating Junction Temperature (°C)
-55to150
Typical Input Capacitance @ Vds (pF)
22@25V
Maximum Drain Source Resistance (mOhm)
5000@10V
Maximum Gate Source Leakage Current (nA)
10
Maximum Positive Gate Source Voltage (V)
20
Maximum Pulsed Drain Current @ TC=25°C (A)
0.8
Maximum Power Dissipation on PCB @ TC=25°C (W)
0.54
Typical Reverse Transfer Capacitance @ Vds (pF)
2@25V
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
0.21
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
348
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