HTS Code

8542.31.00.01

Pin Count

40

Popularity

65

Technology

CMOS

JESD-30 Code

R-GDIP-T40

Package Code

DIP

Boundary Scan

NO

JESD-609 Code

e0

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Low Power Mode

NO

Terminal Pitch

2.54 mm

Screening Level

MIL-STD-883

Terminal Finish

TIN LEAD

Address Bus Width

0

Part Package Code

DIP

Temperature Grade

MILITARY

Terminal Position

DUAL

Supply Current-Max

22 mA

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Number of Terminals

40

Package Description

DIP, DIP40,.6

Part Life Cycle Code

Active

Qualification Status

Not Qualified

Number of Serial I/Os

2

Package Body Material

CERAMIC, GLASS-SEALED

Reach Compliance Code

compliant

Communication Protocol

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

External Data Bus Width

8

Package Equivalence Code

DIP40,.6

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

uPs/uCs/Peripheral ICs Type

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Data Encoding/Decoding Method

NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)