Width

7.62 mm

YTEOL

0

Length

9.58 mm

HTS Code

8542.33.00.01

Objectid

2081046103

ECCN Code

EAR99

Pin Count

8

Risk Rank

9.33

Technology

CMOS

JESD-30 Code

R-GDIP-T8

Package Code

DIP

JESD-609 Code

e0

Package Shape

RECTANGULAR

Package Style

IN-LINE

Slew Rate-Nom

0.55 V/us

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Amplifier Type

OPERATIONAL AMPLIFIER

Terminal Pitch

2.54 mm

Screening Level

MIL-STD-883 Class Q

Terminal Finish

TIN LEAD

Part Package Code

DIP

Seated Height-Max

5.08 mm

Temperature Grade

MILITARY

Terminal Position

DUAL

Unity Gain BW-Nom

730 kHz

Source Content uid

5962-9469201QPX

Number of Functions

2

Number of Terminals

8

Package Description

DIP,

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Package Body Material

CERAMIC, GLASS-SEALED

Reach Compliance Code

unknown

Input Offset Voltage-Max

3000 µV

Supply Voltage Limit-Max

8 V

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

Supply Voltage-Nom (Vsup)

5 V

Common-mode Reject Ratio-Nom

88 dB

Neg Supply Voltage Limit-Max

-8 V

Neg Supply Voltage-Nom (Vsup)

-5 V

Peak Reflow Temperature (Cel)

NOTSPECIFIED

Average Bias Current-Max (IIB)

0.0008 µA

Time@Peak Reflow Temperature-Max (s)

NOTSPECIFIED