Width

1.5 mm

Family

AUP/ULP/V

Length

2.9 mm

Pin Count

5

Brand Name

Nexperia

Popularity

60

Technology

CMOS

JESD-30 Code

R-PDSO-G5

Package Code

TSOP

JESD-609 Code

e3

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR, 7 INCH

Terminal Pitch

0.95 mm

Terminal Finish

TIN

Number of Inputs

1

Part Package Code

TSOP

Seated Height-Max

1.1 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Source Content uid

74AUP1G17GVH

Number of Functions

1

Number of Terminals

5

Package Description

TSOP,

Part Life Cycle Code

Active

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Propagation Delay (tpd)

20.1 ns

Manufacturer Package Code

SOT753

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

0.8 V

Supply Voltage-Nom (Vsup)

1.1 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30