Width

2 mm

Family

HC/UH

Length

2.3 mm

HTS Code

8542.39.00.01

Max I(ol)

0.004 A

Pin Count

8

Rohs Code

Yes

Brand Name

NXP Semiconductor

Popularity

4

Technology

CMOS

Subcategory

Gates

JESD-30 Code

R-PDSO-G8

Package Code

VSSOP

JESD-609 Code

e4

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR

Power Supplies

2/6 V

Terminal Pitch

0.5 mm

Schmitt Trigger

NO

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au)

Number of Inputs

1

Factory Lead Time

4 weeks

Part Package Code

SSOP

Seated Height-Max

1 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Source Content uid

74HC3G07DC,125

Number of Functions

3

Number of Terminals

8

Package Description

2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8

Prop. Delay@Nom-Sup

25 ns

Part Life Cycle Code

Transferred

Qualification Status

Not Qualified

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Output Characteristics

OPEN-DRAIN

Propagation Delay (tpd)

125 ns

Package Equivalence Code

TSSOP8,.12,20

Manufacturer Package Code

SOT765-1

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

6 V

Supply Voltage-Min (Vsup)

2 V

Supply Voltage-Nom (Vsup)

5 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30