Width

1 mm

Family

LVC/LCX/Z

Length

1.45 mm

HTS Code

8542.39.00.01

Max I(ol)

0.024 A

Pin Count

6

Rohs Code

Yes

Brand Name

NXP Semiconductor

Popularity

13

Technology

CMOS

Subcategory

Gates

JESD-30 Code

R-PDSO-N6

Package Code

VSON

JESD-609 Code

e3

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, VERY THIN PROFILE

Surface Mount

YES

Terminal Form

NO LEAD

Packing Method

TR

Power Supplies

3.3 V

Terminal Pitch

0.5 mm

Schmitt Trigger

NO

Terminal Finish

Tin (Sn)

Number of Inputs

1

Part Package Code

SON

Seated Height-Max

0.5 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Source Content uid

74LVC1G07GM,132

Number of Functions

1

Number of Terminals

6

Package Description

1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6

Part Life Cycle Code

Transferred

Qualification Status

Not Qualified

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Output Characteristics

OPEN-DRAIN

Propagation Delay (tpd)

8.4 ns

Package Equivalence Code

SOLCC6,.04,20

Manufacturer Package Code

SOT886

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

1.8 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30