Width

0.8 mm

YTEOL

5.65

Family

AUP/ULP/V

Length

0.8 mm

HTS Code

8542.39.00.01

Objectid

1339533049

ECCN Code

EAR99

Max I(ol)

0.0017 A

Pin Count

4

Risk Rank

7.67

Rohs Code

Yes

Technology

CMOS

Subcategory

Gates

JESD-30 Code

S-PDSO-N5

Package Code

HVSON

JESD-609 Code

e4

Logic IC Type

BUFFER

Package Shape

SQUARE

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Surface Mount

YES

Terminal Form

NO LEAD

Packing Method

TR

Power Supplies

1.2/3.3 V

Terminal Pitch

0.48 mm

Schmitt Trigger

YES

Terminal Finish

NICKEL PALLADIUM GOLD

Number of Inputs

1

Factory Lead Time

24 weeks

Part Package Code

DFN

Seated Height-Max

0.35 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Number of Functions

1

Number of Terminals

5

Package Description

HVSON, LCC5(UNSPEC)

Prop. Delay@Nom-Sup

20.1 ns

Part Life Cycle Code

Active

Qualification Status

Not Qualified

Load Capacitance (CL)

30 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Propagation Delay (tpd)

20.1 ns

Package Equivalence Code

LCC5(UNSPEC)

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

0.8 V

Supply Voltage-Nom (Vsup)

3 V

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30