Width

7.62 mm

Family

HC/UH

Length

19.025 mm

HTS Code

8542.39.00.01

ECCN Code

EAR99

Max I(ol)

0.004 A

Pin Count

14

Rohs Code

Yes

Brand Name

NXP Semiconductor

Popularity

294

Technology

CMOS

Subcategory

Gates

JESD-30 Code

R-PDIP-T14

Package Code

DIP

JESD-609 Code

e4

Logic IC Type

NAND GATE

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Packing Method

BULK

Terminal Pitch

2.54 mm

Schmitt Trigger

NO

Terminal Finish

NICKEL PALLADIUM GOLD

Number of Inputs

2

Factory Lead Time

4 weeks

Part Package Code

DIP

Seated Height-Max

4.2 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Source Content uid

74HC00N,652

Number of Functions

4

Number of Terminals

14

Package Description

DIP, DIP14,.3

Prop. Delay@Nom-Sup

27 ns

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Propagation Delay (tpd)

135 ns

Package Equivalence Code

DIP14,.3

Manufacturer Package Code

SOT27-1

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

6 V

Supply Voltage-Min (Vsup)

2 V

Supply Voltage-Nom (Vsup)

5 V