Width

1.5 mm

YTEOL

6.5

Family

LVC/LCX/Z

Length

2.9 mm

HTS Code

8542.39.00.01

Objectid

4002408879

Risk Rank

7.58

Rohs Code

Yes

Technology

CMOS

JESD-30 Code

R-PDSO-G6

Package Code

TSSOP

JESD-609 Code

e3

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR, 7 INCH

Terminal Pitch

0.95 mm

Screening Level

AEC-Q100

Terminal Finish

TIN

Number of Inputs

1

Country Of Origin

Malaysia

Seated Height-Max

1.1 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Source Content uid

935301511125

Number of Functions

2

Number of Terminals

6

Package Description

TSSOP,

Part Life Cycle Code

Active

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Output Characteristics

OPEN-DRAIN

Propagation Delay (tpd)

8.4 ns

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

3.3 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30