Width

2 mm

YTEOL

5.5

Family

ALVC/VCX/A

Length

2.3 mm

HTS Code

8542.39.00.01

Objectid

1818618292

Max I(ol)

0.024 A

Pin Count

8

Risk Rank

7.25

Rohs Code

Yes

Technology

CMOS

Pbfree Code

No

Subcategory

Gates

JESD-30 Code

R-PDSO-G8

Package Code

VSSOP

JESD-609 Code

e0

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR

Power Supplies

3.3 V

Terminal Pitch

0.5 mm

Schmitt Trigger

NO

Number of Inputs

1

Part Package Code

SOIC

Seated Height-Max

0.9 mm

Temperature Grade

INDUSTRIAL

Terminal Position

DUAL

Source Content uid

HD74ALVC2G07USE

Number of Functions

3

Number of Terminals

8

Package Description

VSSOP, TSSOP8,.12,20

Prop. Delay@Nom-Sup

2.5 ns

Part Life Cycle Code

Active

Qualification Status

Not Qualified

Load Capacitance (CL)

30 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Output Characteristics

OPEN-DRAIN

Propagation Delay (tpd)

7 ns

Package Equivalence Code

TSSOP8,.12,20

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

1.2 V

Supply Voltage-Nom (Vsup)

1.5 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

20