Width

1.25 mm

Family

LV/LV-A/LVX/H

Length

2 mm

HTS Code

8542.39.00.01

Max I(ol)

0.006 A

Pin Count

6

Popularity

31

Technology

CMOS

Subcategory

Gate

JESD-30 Code

R-PDSO-G6

Package Code

TSSOP

JESD-609 Code

e6

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR

Power Supplies

3.3 V

Terminal Pitch

0.65 mm

Schmitt Trigger

YES

Terminal Finish

TIN BISMUTH

Number of Inputs

1

Part Package Code

SOIC

Seated Height-Max

1.1 mm

Temperature Grade

INDUSTRIAL

Terminal Position

DUAL

Source Content uid

HD74LV1GW17ACME

Number of Functions

2

Number of Terminals

6

Package Description

TSSOP, TSSOP6,.08

Prop. Delay@Nom-Sup

18.5 ns

Part Life Cycle Code

Active

Qualification Status

Not Qualified

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Propagation Delay (tpd)

46 ns

Package Equivalence Code

TSSOP6,.08

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

1.8 V