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LPC5526JBD100
3403 In Stock
LPC5526JBD100
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Manufacturer No:
NXP Semiconductors
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers - MCUs
Package:
HLQFP EP
Datasheet:
Description Differential:
MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 100-Pin HLQFP EP Tray
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Type
DESCRIPTION
CAN
0
I2C
8
I2S
8
SPI
8
USB
2
PPAP
No
UART
0
USART
8
Ethernet
0
Mounting
Surface Mount
RAM Size
144KB
Packaging
Tray
Pin Count
100
Automotive
No
Device Core
ARM Cortex M33
PCB changed
100
Part Status
Active
ADC Channels
10
No. of Timers
5
Package Width
14
Interface Type
I2C/I2S/SPI/USART/USB
Number of ADCs
Single
Number of I/Os
64
Package Height
1.45(Max)
Package Length
14
Programmability
Yes
Supplier Package
HLQFP EP
Core Architecture
ARM
Process Technology
40nm
Program Memory Size
256KB
Program Memory Type
Flash
ADC Resolution (bit)
16
Data Bus Width (bit)
32
Standard Package Name
QFP
Maximum Clock Rate (MHz)
150
Maximum CPU Frequency (MHz)
150
Instruction Set Architecture
RISC
Maximum Operating Temperature (°C)
105
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
1.8
Typical Operating Supply Voltage (V)
3.3
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