HTS Code

8542.33.00.01

ECCN Code

EAR99

Low-Offset

YES

Popularity

0

Technology

BIPOLAR

Architecture

VOLTAGE-FEEDBACK

JESD-30 Code

R-XUUC-N8

Package Code

DIE

Package Shape

RECTANGULAR

Package Style

UNCASED CHIP

Slew Rate-Min

0.2 V/us

Surface Mount

YES

Terminal Form

NO LEAD

Amplifier Type

OPERATIONAL AMPLIFIER

Screening Level

MIL-STD-883 Class S (Modified)

Voltage Gain-Min

500000

Temperature Grade

MILITARY

Terminal Position

UPPER

Source Content uid

RH1013DICE

Supply Current-Max

1.1 mA

Number of Functions

2

Number of Terminals

8

Package Description

DIE, DIE OR CHIP

Part Life Cycle Code

Transferred

Qualification Status

Not Qualified

Package Body Material

UNSPECIFIED

Reach Compliance Code

compliant

Frequency Compensation

YES

Input Offset Voltage-Max

300 µV

Package Equivalence Code

DIE OR CHIP

Supply Voltage Limit-Max

22 V

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

Supply Voltage-Nom (Vsup)

15 V

Bias Current-Max (IIB) @25C

0.03 µA

Common-mode Reject Ratio-Nom

97 dB

Neg Supply Voltage Limit-Max

-22 V

Neg Supply Voltage-Nom (Vsup)

-15 V

Average Bias Current-Max (IIB)

0.03 µA