Width

0.9 mm

Family

AUP/ULP/V

Length

1.4 mm

Pin Count

6

Popularity

8

Pbfree Code

No

JESD-30 Code

R-XBGA-B6

Package Code

VFBGA

JESD-609 Code

e0

Logic IC Type

LOGIC CIRCUIT

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Surface Mount

YES

Terminal Form

BALL

Terminal Pitch

0.5 mm

Terminal Finish

TIN LEAD

Part Package Code

BGA

Seated Height-Max

0.5 mm

Temperature Grade

INDUSTRIAL

Terminal Position

BOTTOM

Number of Functions

1

Number of Terminals

6

Package Description

DSBGA-6

Part Life Cycle Code

Active

Qualification Status

COMMERCIAL

Package Body Material

UNSPECIFIED

Reach Compliance Code

unknown

Output Characteristics

3-STATE

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

0.8 V

Supply Voltage-Nom (Vsup)

1.2 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

NOTSPECIFIED