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2937 In Stock

TZA3010BVH

2937 In Stock

TZA3010BVH

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Manufacturer No:

NXP Semiconductors

Manufacturer:

NXP Semiconductors

Category:

Other Interface ICs

Package:

HVBCC, LCC32,.2SQ,20

Datasheet:

Description Differential:

IC SPECIALTY INTERFACE CIRCUIT, PBCC32, 5 X 5 X 0.65 MM, PLASTIC, MO-217, SOT-560-1, HBCC-32, Interface IC:Other

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    Type

    DESCRIPTION

    Width

    5 mm

    YTEOL

    0

    Length

    5 mm

    HTS Code

    8542.39.00.01

    Objectid

    1936383834

    Pin Count

    32

    Risk Rank

    9.65

    Rohs Code

    Yes

    Technology

    BICMOS

    Pbfree Code

    Yes

    JESD-30 Code

    S-PBCC-B32

    Package Code

    HVBCC

    JESD-609 Code

    e4

    Package Shape

    SQUARE

    Package Style

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

    Surface Mount

    YES

    Terminal Form

    BUTT

    Terminal Pitch

    0.5 mm

    Terminal Finish

    NICKEL PALLADIUM GOLD

    Interface IC Type

    INTERFACE CIRCUIT

    Part Package Code

    BCC

    Seated Height-Max

    0.8 mm

    Temperature Grade

    INDUSTRIAL

    Terminal Position

    BOTTOM

    Source Content uid

    TZA3010BVH

    Supply Voltage-Max

    3.47 V

    Supply Voltage-Min

    3.14 V

    Supply Voltage-Nom

    3.3 V

    Number of Functions

    1

    Number of Terminals

    32

    Package Description

    HVBCC, LCC32,.2SQ,20

    Supply Voltage1-Max

    3.47 V

    Supply Voltage1-Min

    3.14 V

    Supply Voltage1-Nom

    3.3 V

    Part Life Cycle Code

    Obsolete

    Qualification Status

    Not Qualified

    Package Body Material

    PLASTIC/EPOXY

    Reach Compliance Code

    compliant

    Package Equivalence Code

    LCC32,.2SQ,20

    Manufacturer Package Code

    SOT-560-1

    Operating Temperature-Max

    85°C

    Operating Temperature-Min

    -40°C

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