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2937 In Stock
TZA3010BVH
2937 In Stock
TZA3010BVH
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Manufacturer No:
NXP Semiconductors
Manufacturer:
NXP Semiconductors
Category:
Other Interface ICs
Package:
HVBCC, LCC32,.2SQ,20
Datasheet:
Description Differential:
IC SPECIALTY INTERFACE CIRCUIT, PBCC32, 5 X 5 X 0.65 MM, PLASTIC, MO-217, SOT-560-1, HBCC-32, Interface IC:Other
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Type
DESCRIPTION
Width
5 mm
YTEOL
0
Length
5 mm
HTS Code
8542.39.00.01
Objectid
1936383834
Pin Count
32
Risk Rank
9.65
Rohs Code
Yes
Technology
BICMOS
Pbfree Code
Yes
JESD-30 Code
S-PBCC-B32
Package Code
HVBCC
JESD-609 Code
e4
Package Shape
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Surface Mount
YES
Terminal Form
BUTT
Terminal Pitch
0.5 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Interface IC Type
INTERFACE CIRCUIT
Part Package Code
BCC
Seated Height-Max
0.8 mm
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Source Content uid
TZA3010BVH
Supply Voltage-Max
3.47 V
Supply Voltage-Min
3.14 V
Supply Voltage-Nom
3.3 V
Number of Functions
1
Number of Terminals
32
Package Description
HVBCC, LCC32,.2SQ,20
Supply Voltage1-Max
3.47 V
Supply Voltage1-Min
3.14 V
Supply Voltage1-Nom
3.3 V
Part Life Cycle Code
Obsolete
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Reach Compliance Code
compliant
Package Equivalence Code
LCC32,.2SQ,20
Manufacturer Package Code
SOT-560-1
Operating Temperature-Max
85°C
Operating Temperature-Min
-40°C
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