Width

7.62 mm

Family

HC/UH

Length

19.305 mm

HTS Code

8542.39.00.01

Max I(ol)

0.004 A

Pin Count

16

Rohs Code

No

Brand Name

Texas Instruments

Popularity

25

Technology

CMOS

Subcategory

Gate

JESD-30 Code

R-PDIP-T16

Package Code

DIP

JESD-609 Code

e4

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Packing Method

TUBE

Power Supplies

2/6 V

Terminal Pitch

2.54 mm

Schmitt Trigger

NO

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au)

Number of Inputs

1

Part Package Code

DIP

Seated Height-Max

5.08 mm

Temperature Grade

MILITARY

Terminal Position

DUAL

Additional Feature

CMOS-TTL LEVEL TRANSLATOR

Source Content uid

CD74HC4050EE4

Number of Functions

6

Number of Terminals

16

Package Description

DIP, DIP16,.3

Prop. Delay@Nom-Sup

26 ns

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Propagation Delay (tpd)

130 ns

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

Supply Voltage-Max (Vsup)

6 V

Supply Voltage-Min (Vsup)

2 V

Supply Voltage-Nom (Vsup)

4.5 V

Peak Reflow Temperature (Cel)

NOTSPECIFIED

Power Supply Current-Max (ICC)

0.04 mA

Time@Peak Reflow Temperature-Max (s)

NOTSPECIFIED