Width

7.62 mm

Length

19.43 mm

HTS Code

8542.32.00.41

ECCN Code

3A001.A.2.C

Pin Count

16

Rohs Code

No

Popularity

11

Technology

CMOS

Subcategory

Other Memory ICs

JESD-30 Code

R-GDIP-T16

Memory Width

4

Organization

4X4

Package Code

DIP

JESD-609 Code

e0

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Memory Density

16 bit

Memory IC Type

STANDARD SRAM

Operating Mode

ASYNCHRONOUS

Power Supplies

5 V

Terminal Pitch

2.54 mm

Access Time-Max

55 ns

Number of Words

4 words

Parallel/Serial

PARALLEL

Terminal Finish

TIN LEAD

Part Package Code

DIP

Seated Height-Max

5.08 mm

Temperature Grade

MILITARY

Terminal Position

DUAL

Source Content uid

DM54LS670J

Number of Functions

1

Number of Terminals

16

Package Description

DIP, DIP16,.3

Number of Words Code

4

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Package Body Material

CERAMIC, GLASS-SEALED

Reach Compliance Code

unknown

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

4.5 V

Supply Voltage-Nom (Vsup)

5 V