Width

1.25 mm

Family

AUP/ULP/V

Length

2 mm

HTS Code

8542.39.00.01

Max I(ol)

0.0017 A

Pin Count

5

Rohs Code

Yes

Popularity

3

Technology

CMOS

Pbfree Code

Yes

Subcategory

Gates

JESD-30 Code

R-PDSO-G5

Package Code

TSSOP

JESD-609 Code

e4

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR

Power Supplies

1.2/3.3 V

Terminal Pitch

0.65 mm

Schmitt Trigger

NO

Terminal Finish

NICKEL PALLADIUM GOLD

Number of Inputs

1

Part Package Code

SOIC

Seated Height-Max

1.1 mm

Temperature Grade

INDUSTRIAL

Terminal Position

DUAL

Source Content uid

SN74AUP1G07DCKTE4

Number of Functions

1

Number of Terminals

5

Package Description

TSSOP, TSSOP5/6,.08

Prop. Delay@Nom-Sup

21.9 ns

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Load Capacitance (CL)

30 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

unknown

Output Characteristics

OPEN-DRAIN

Propagation Delay (tpd)

14.7 ns

Package Equivalence Code

TSSOP5/6,.08

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

0.8 V

Supply Voltage-Nom (Vsup)

1.1 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30