Width

0.77 mm

Family

AUP/ULP/V

Length

1.17 mm

HTS Code

8542.39.00.01

ECCN Code

EAR99

Max I(ol)

0.004 A

Pin Count

6

Rohs Code

Yes

Brand Name

Texas Instruments

Popularity

9

Technology

CMOS

Pbfree Code

Yes

Subcategory

Gates

JESD-30 Code

R-XBGA-B6

Package Code

VFBGA

JESD-609 Code

e1

Logic IC Type

MAJORITY LOGIC GATE

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Surface Mount

YES

Terminal Form

BALL

Packing Method

TR

Power Supplies

1.2/3.3 V

Terminal Pitch

0.4 mm

Schmitt Trigger

YES

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Number of Inputs

3

Part Package Code

BGA

Seated Height-Max

0.5 mm

Temperature Grade

INDUSTRIAL

Terminal Position

BOTTOM

Source Content uid

SN74AUP1G58YFPR

Number of Functions

1

Number of Terminals

6

Package Description

VFBGA, BGA6,2X3,16

Part Life Cycle Code

Active

Qualification Status

Not Qualified

Load Capacitance (CL)

30 pF

Package Body Material

UNSPECIFIED

Reach Compliance Code

compliant

Propagation Delay (tpd)

26.2 ns

Package Equivalence Code

BGA6,2X3,16

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

0.8 V

Supply Voltage-Nom (Vsup)

1.2 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Power Supply Current-Max (ICC)

0.0009 mA

Time@Peak Reflow Temperature-Max (s)

NOTSPECIFIED