Width

0.9 mm

Family

LVC/LCX/Z

Length

1.9 mm

fmax-Min

200 MHz

Pin Count

8

Popularity

9

Technology

CMOS

Pbfree Code

Yes

JESD-30 Code

R-XBGA-B8

Package Code

VFBGA

Trigger Type

POSITIVE EDGE

JESD-609 Code

e0

Logic IC Type

D FLIP-FLOP

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Surface Mount

YES

Terminal Form

BALL

Number of Bits

1

Terminal Pitch

0.5 mm

Output Polarity

COMPLEMENTARY

Terminal Finish

TIN LEAD

Part Package Code

DSBGA

Seated Height-Max

0.5 mm

Temperature Grade

INDUSTRIAL

Terminal Position

BOTTOM

Number of Functions

1

Number of Terminals

8

Package Description

MO-211EB,DSBGA-8

Part Life Cycle Code

Active

Qualification Status

COMMERCIAL

Package Body Material

UNSPECIFIED

Reach Compliance Code

unknown

Output Characteristics

3-STATE

Propagation Delay (tpd)

14.4 ns

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

5.5 V

Supply Voltage-Min (Vsup)

1.65 V

Supply Voltage-Nom (Vsup)

1.8 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

NOTSPECIFIED