Width

1.25 mm

Family

AUP/ULP/V

Length

2 mm

HTS Code

8542.39.00.01

Max I(ol)

0.004 A

Pin Count

6

Rohs Code

Yes

Brand Name

NXP Semiconductor

Popularity

61

Technology

CMOS

Subcategory

Gates

JESD-30 Code

R-PDSO-G6

Package Code

TSSOP

JESD-609 Code

e3

Logic IC Type

LOGIC CIRCUIT

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Surface Mount

YES

Terminal Form

GULL WING

Packing Method

TR

Power Supplies

2.5/3.3 V

Terminal Pitch

0.65 mm

Schmitt Trigger

YES

Terminal Finish

Tin (Sn)

Factory Lead Time

4 weeks

Part Package Code

TSSOP

Seated Height-Max

1.1 mm

Temperature Grade

AUTOMOTIVE

Terminal Position

DUAL

Source Content uid

74AUP1T58GW,125

Number of Functions

1

Number of Terminals

6

Package Description

PLASTIC, SOT-363, SC-88, PACKAGE-6

Prop. Delay@Nom-Sup

9.4 ns

Part Life Cycle Code

Transferred

Qualification Status

Not Qualified

Load Capacitance (CL)

30 pF

Package Body Material

PLASTIC/EPOXY

Reach Compliance Code

compliant

Package Equivalence Code

TSSOP6,.08

Manufacturer Package Code

SOT363

Operating Temperature-Max

125°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

2.3 V

Supply Voltage-Nom (Vsup)

3 V

Moisture Sensitivity Level

1

Peak Reflow Temperature (Cel)

260

Time@Peak Reflow Temperature-Max (s)

30