Width

0.9 mm

Family

AUP/ULP/V

Length

1.4 mm

HTS Code

8542.39.00.01

Max I(ol)

0.0017 A

Pin Count

5

Rohs Code

No

Popularity

0

Technology

CMOS

Subcategory

Gates

JESD-30 Code

R-XBGA-B5

Package Code

VFBGA

Logic IC Type

BUFFER

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Surface Mount

YES

Terminal Form

BALL

Packing Method

TR

Terminal Pitch

0.5 mm

Schmitt Trigger

NO

Number of Inputs

1

Part Package Code

BGA

Seated Height-Max

0.5 mm

Temperature Grade

INDUSTRIAL

Terminal Position

BOTTOM

Source Content uid

SN74AUP1G34YEPR

Number of Functions

1

Number of Terminals

5

Package Description

VFBGA, BGA5,2X3,20

Prop. Delay@Nom-Sup

18.9 ns

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Load Capacitance (CL)

30 pF

Package Body Material

UNSPECIFIED

Reach Compliance Code

not_compliant

Output Characteristics

3-STATE

Propagation Delay (tpd)

18.9 ns

Package Equivalence Code

BGA5,2X3,20

Operating Temperature-Max

85°C

Operating Temperature-Min

-40°C

Supply Voltage-Max (Vsup)

3.6 V

Supply Voltage-Min (Vsup)

0.8 V

Supply Voltage-Nom (Vsup)

1.2 V

Peak Reflow Temperature (Cel)

NOTSPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOTSPECIFIED