Width

15.24 mm

HTS Code

8542.31.00.01

Pin Count

40

Rohs Code

No

Popularity

19

Technology

CMOS

RAM (words)

0

Subcategory

Other Microprocessor ICs

JESD-30 Code

R-CDIP-T40

Package Code

DIP

Boundary Scan

NO

JESD-609 Code

e0

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Low Power Mode

NO

Power Supplies

5 V

Terminal Pitch

2.54 mm

Screening Level

38535Q/M;38534H;883B

Terminal Finish

Tin/Lead (Sn/Pb)

Part Package Code

DIP

Seated Height-Max

4.699 mm

Temperature Grade

MILITARY

Terminal Position

DUAL

Additional Feature

MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS; 10 X 19 FRAME STATUS FIFO

Supply Current-Max

18 mA

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Clock Frequency-Max

10 MHz

Number of I/O Lines

0

Number of Terminals

40

Package Description

DIP, DIP40,.6

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Number of Serial I/Os

2

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reach Compliance Code

unknown

Communication Protocol

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC

Number of DMA Channels

0

On Chip Data RAM Width

0

External Data Bus Width

8

Package Equivalence Code

DIP40,.6

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

uPs/uCs/Peripheral ICs Type

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Data Encoding/Decoding Method

NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)