Width

15.24 mm

YTEOL

0

HTS Code

8542.31.00.01

Objectid

2081036239

Pin Count

40

Risk Rank

8.65

Technology

CMOS

JESD-30 Code

R-CDIP-T40

Package Code

DIP

Boundary Scan

NO

Package Shape

RECTANGULAR

Package Style

IN-LINE

Surface Mount

NO

Terminal Form

THROUGH-HOLE

Low Power Mode

NO

Terminal Pitch

2.54 mm

Screening Level

38535Q/M;38534H;883B

Address Bus Width

Part Package Code

DIP

Seated Height-Max

4.699 mm

Temperature Grade

MILITARY

Terminal Position

DUAL

Supply Current-Max

18 mA

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

Clock Frequency-Max

8 MHz

Number of Terminals

40

Package Description

DIP, DIP40,.6

Part Life Cycle Code

Obsolete

Qualification Status

Not Qualified

Number of Serial I/Os

2

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Reach Compliance Code

unknown

Communication Protocol

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

Data Transfer Rate-Max

0.3125 MBps

External Data Bus Width

8

Package Equivalence Code

DIP40,.6

Operating Temperature-Max

125°C

Operating Temperature-Min

-55°C

uPs/uCs/Peripheral ICs Type

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Data Encoding/Decoding Method

NRZ; NRZI; BIPH-SPACE(FM0); BIPH-MARK(FM1); BIPH-LEVEL (MANCHESTER)